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| the contents of this document are subject to change without notice. customers are advised to consult with fujitsu sales representatives before ordering. fujitsu is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document. fujitsu semiconductor data sheet small outline l-leaded package 8 pin plastic 8-pin plastic sop lead pitch 1.27 mm package width package length 5.3 6.35 mm lead shape gullwing sealing method plastic mold mounting height 2.25 mm max weight 0.10 g code (reference) p-sop8-5.3 6.35-1.27 8-pin plastic sop (FPT-8P-M01) (FPT-8P-M01) c 2002 fujitsu limited f08002s-c-6-7 0.13(.005) m details of "a" part 7.800.40 5.300.30 (.209.012) (.307.016) .250 C.008 +.010 C0.20 +0.25 6.35 index 1.27(.050) 0.10(.004) 14 5 8 0.470.08 (.019.003) C0.04 +0.03 0.17 .007 +.001 C.002 "a" 0.25(.010) (stand off) 0~8 ? (mounting height) 2.00 +0.25 C0.15 .079 +.010 C.006 0.500.20 (.020.008) 0.600.15 (.024.006) 0.10 +0.10 C0.05 C.002 +.004 .004 * 1 0.10(.004) * 2 dimensions in mm (inches). note: the values in parentheses are reference values. FPT-8P-M01 0212 note 1) * 1 : these dimensions include resin protrusion. note 2) * 2 : these dimensions do not include resin protrusion. note 3) pins width and pins thickness include plating thickness. note 4) pins width do not include tie bar cutting remainder.
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